Copyright © 2019 by Cayley Nielson Press, Inc.
Cayley Nielson Press Scholarly Monograph Series Book Code No.: 209-7-1
This book should be useful for students, scientists, engineers and professionals working in the areas of optoelectronic packaging, photonic devices, semiconductor technology, materials science, polymer science, electrical and electronics engineering. This book could be used for one semester course on adhesives for photonics packaging designed for both undergraduate and graduate engineering students.
Prospective authors should note that only original and previously unpublished manuscripts will be considered. The authors should ensure that they have written entirely original works, and if the authors have used the work and/or words of others, that this has been appropriately cited or quoted. Furthermore, simultaneous submissions are not acceptable. Submission of a manuscript is interpreted as a statement of certification that no part of the manuscript is copyrighted by any other publication nor is under review by any other formal publication. It is the primary responsibility of the author to obtain proper permission for the use of any copyrighted materials in the manuscript, prior to the submission of the manuscript.